مؤتمر
True 3D packaging solution for stacked vertical power devices
| العنوان: | True 3D packaging solution for stacked vertical power devices |
|---|---|
| المؤلفون: | Rouger, N., Benaissa, L., Widiez, J., Imbert, B., Gaude, V., Verrun, S., Crebier, J C. |
| المصدر: | 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on. :97-100 May, 2013 |
| Relation: | 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467351348 9781467351355 9781467351362 |
|---|---|
| تدمد: | 10636854 19460201 |
| DOI: | 10.1109/ISPSD.2013.6694405 |