مؤتمر
3D electromagnetic simulation of interconnect fault inspection based on magnetic field behavior
| العنوان: | 3D electromagnetic simulation of interconnect fault inspection based on magnetic field behavior |
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| المؤلفون: | Soeung, S., Ali, N. B. Zain, Khir, M. H. Md |
| المصدر: | RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics Micro and Nanoelectronics (RSM), 2013 IEEE Regional Symposium on. :387-390 Sep, 2013 |
| Relation: | 2013 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479911813 9781479911837 |
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| DOI: | 10.1109/RSM.2013.6706572 |