مؤتمر
A novel through-hole filling technology for next generation organic interposer applications
العنوان: | A novel through-hole filling technology for next generation organic interposer applications |
---|---|
المؤلفون: | Liu, Tao-Chi, Wang, Shing-Ru, Corey, Michael |
المصدر: | 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :47-50 Oct, 2013 |
Relation: | 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479906673 |
---|---|
تدمد: | 21505934 21505942 |
DOI: | 10.1109/IMPACT.2013.6706668 |