مؤتمر
A novel through-hole filling technology for next generation organic interposer applications
| العنوان: | A novel through-hole filling technology for next generation organic interposer applications |
|---|---|
| المؤلفون: | Liu, Tao-Chi, Wang, Shing-Ru, Corey, Michael |
| المصدر: | 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :47-50 Oct, 2013 |
| Relation: | 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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