مؤتمر
AMI: A new thin film substrate technology
| العنوان: | AMI: A new thin film substrate technology |
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| المؤلفون: | Hurwitz, D., Igner, E., Yofis, B., Katz, D. |
| المصدر: | Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Multichip modules and high density packaging Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on. :98-105 1998 |
| Relation: | Proceedings 1998 International Conference on Multichip Modules and High Density Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780348508 9780780348509 |
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| DOI: | 10.1109/ICMCM.1998.670762 |