AMI: A new thin film substrate technology

التفاصيل البيبلوغرافية
العنوان: AMI: A new thin film substrate technology
المؤلفون: Hurwitz, D., Igner, E., Yofis, B., Katz, D.
المصدر: Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Multichip modules and high density packaging Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on. :98-105 1998
Relation: Proceedings 1998 International Conference on Multichip Modules and High Density Packaging
قاعدة البيانات: IEEE Xplore Digital Library