Analysis of electro-thermal-stress failure of the LDMOS FET under HPM pulses

التفاصيل البيبلوغرافية
العنوان: Analysis of electro-thermal-stress failure of the LDMOS FET under HPM pulses
المؤلفون: Zhou, Wei-feng, Zhou, Liang, Mao, Jun-Fa, Peng, Hong-li, Yin, Wen-Yan
المصدر: 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE. :205-208 Dec, 2013
Relation: 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781479923137
9781479923113
تدمد:21511225
21511233
DOI:10.1109/EDAPS.2013.6724425