دورية أكاديمية
A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys
| العنوان: | A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys |
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| المؤلفون: | Burke, C., Punch, J. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(3):516-527 Mar, 2014 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2014.2299400 |