التفاصيل البيبلوغرافية
| العنوان: |
A 3D package design with cavity substrate and stacked die |
| المؤلفون: |
Xie, Huiqin, Li, Jun, Song, Jian, Hou, Fengze, Guo, Xueping, Wang, Shuling, Daquan, Yu, Liqiang, Cao, Wan, Lixi |
| المصدر: |
2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :64-67 Aug, 2013 |
| Relation: |
2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder