مؤتمر
A 3D package design with cavity substrate and stacked die
العنوان: | A 3D package design with cavity substrate and stacked die |
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المؤلفون: | Xie, Huiqin, Li, Jun, Song, Jian, Hou, Fengze, Guo, Xueping, Wang, Shuling, Daquan, Yu, Liqiang, Cao, Wan, Lixi |
المصدر: | 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :64-67 Aug, 2013 |
Relation: | 2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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