مؤتمر
Assembly process simulation of TSV interposer
| العنوان: | Assembly process simulation of TSV interposer |
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| المؤلفون: | Si, Chen, Fei, Qin, Guofeng, Xia, Wei, Wu, Daquan, Yu, Yuan, Lu |
| المصدر: | 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :234-237 Aug, 2013 |
| Relation: | 2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479904983 |
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| DOI: | 10.1109/ICEPT.2013.6756461 |