مؤتمر
Assembly process simulation of TSV interposer
العنوان: | Assembly process simulation of TSV interposer |
---|---|
المؤلفون: | Si, Chen, Fei, Qin, Guofeng, Xia, Wei, Wu, Daquan, Yu, Yuan, Lu |
المصدر: | 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :234-237 Aug, 2013 |
Relation: | 2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479904983 |
---|---|
DOI: | 10.1109/ICEPT.2013.6756461 |