التفاصيل البيبلوغرافية
| العنوان: |
The influence of silver content on the reliability of lead-free solder joints under drop condition |
| المؤلفون: |
Yongping, Lei, Jinli, Yang, Jian, Lin, Hanguang, Fu, Baoquan, Liu, Hailong, Bai, Junhu, Qin |
| المصدر: |
2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :826-829 Aug, 2013 |
| Relation: |
2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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