مؤتمر
High quality & low thermal resistance eutectic flip chip LED bonding
| العنوان: | High quality & low thermal resistance eutectic flip chip LED bonding |
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| المؤلفون: | Lam, Ngai-Sze, Lee, Chi-Yung, Wan, Ming-Yeung, Tian, Dewen, Li, Ming |
| المصدر: | 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :1197-1201 Aug, 2013 |
| Relation: | 2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479904983 |
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| DOI: | 10.1109/ICEPT.2013.6756673 |