مؤتمر
Encapsulant materials for flip-chip attach
| العنوان: | Encapsulant materials for flip-chip attach |
|---|---|
| المؤلفون: | Gopalakrishnan, L., Ranjan, M., Sha, Y., Srihari, K., Woychik, C. |
| المصدر: | 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Electronic components and technology Electronic Components & Technology Conference, 1998. 48th IEEE. :1291-1297 1998 |
| Relation: | 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780345266 9780780345263 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.1998.678909 |