مؤتمر
Newly developed ultra thin fan-out wafer level package for PoP usage
| العنوان: | Newly developed ultra thin fan-out wafer level package for PoP usage |
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| المؤلفون: | Shimamoto, H., Soga, K., Takemra, K., Yanagisawa, H., Asai, S., Kondo, K., Sugo, M., Kato, H., Matsuda, Y. |
| المصدر: | 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :30-33 Apr, 2014 |
| Relation: | 2014 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784904090107 9784904090114 |
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| DOI: | 10.1109/ICEP.2014.6826655 |