مؤتمر
Newly developed ultra thin fan-out wafer level package for PoP usage
العنوان: | Newly developed ultra thin fan-out wafer level package for PoP usage |
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المؤلفون: | Shimamoto, H., Soga, K., Takemra, K., Yanagisawa, H., Asai, S., Kondo, K., Sugo, M., Kato, H., Matsuda, Y. |
المصدر: | 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :30-33 Apr, 2014 |
Relation: | 2014 International Conference on Electronics Packaging (ICEP) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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