مؤتمر
Contact module at dense gate pitch technology challenges
| العنوان: | Contact module at dense gate pitch technology challenges |
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| المؤلفون: | Demuynck, S., Mao, M., Kunnen, E., Versluijs, J., Croes, K., Wu, C., Schaekers, M., Peter, A., Kauerauf, T., Teugels, L., Bommels, J. |
| المصدر: | IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :307-310 May, 2014 |
| Relation: | 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479950164 9781479950188 |
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| تدمد: | 2380632X 23806338 |
| DOI: | 10.1109/IITC.2014.6831894 |