Reducing breakthrough dislocation toward Si/SiGe heterostructure to improve advanced HKMG SRAM device performance by optimizing fluorine co-implantation

التفاصيل البيبلوغرافية
العنوان: Reducing breakthrough dislocation toward Si/SiGe heterostructure to improve advanced HKMG SRAM device performance by optimizing fluorine co-implantation
المؤلفون: Chin, Y. L., Lin, Y. S., Hu, Y. C., Chang, M. H., Yu, T. W., Chen, W. T., Yang, C. Y., Lin, Y. J., Chien, C. C., Wu, J. Y.
المصدر: 2014 International Workshop on Junction Technology (IWJT) Junction Technology (IWJT), 2014 International Workshop on. :1-4 May, 2014
Relation: 2014 14th International Workshop on Junction Technology (IWJT)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781479936274
DOI:10.1109/IWJT.2014.6842052