مؤتمر
The effect of backside roughness on Al interconnect dimensions for RF CMOS SOI devices
العنوان: | The effect of backside roughness on Al interconnect dimensions for RF CMOS SOI devices |
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المؤلفون: | Moon, Matthew D., Gambino, Jeffrey P., Adderly, Shawn A., Hanrahan, Jeffrey, Cucci, Brett |
المصدر: | 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI. :384-388 May, 2014 |
Relation: | 2014 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479939442 |
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تدمد: | 10788743 23766697 |
DOI: | 10.1109/ASMC.2014.6846960 |