التفاصيل البيبلوغرافية
| العنوان: |
Boron Nitride Nanoparticles-based thermal adhesives for thermal management of high-temperature electronics |
| المؤلفون: |
Coker, Zachary, Diaz, Hugo, D'Souza, Nandika, Tae-Youl Choi |
| المصدر: |
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :421-425 May, 2014 |
| Relation: |
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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