مؤتمر
A novel drop test methodology for highly stressed interconnects in automotive electronic control units
| العنوان: | A novel drop test methodology for highly stressed interconnects in automotive electronic control units |
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| المؤلفون: | Shirangi, M. H., Simo, G. Tsebo, Wang, Z., Unnikrishnan, R., Heinrich, T. |
| المصدر: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :108-113 May, 2014 |
| Relation: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479924073 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2014.6897274 |