مؤتمر
Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications
| العنوان: | Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications |
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| المؤلفون: | Wu, Hao, Gardner, Donald S., Lv, Cheng, Zou, Zhihua, Yu, Hongbin |
| المصدر: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1290-1295 May, 2014 |
| Relation: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479924073 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2014.6897458 |