مؤتمر
On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
العنوان: | On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach |
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المؤلفون: | Ndip, Ivan, Lobbicke, Kai, Tschoban, Christian, Ranzinger, Christian, Richlowski, Karim, Contag, Andreas, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino |
المصدر: | 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on. :491-495 Aug, 2014 |
Relation: | 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479955442 9781479955435 9781479955459 |
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تدمد: | 2158110X 21581118 |
DOI: | 10.1109/ISEMC.2014.6899022 |