التفاصيل البيبلوغرافية
العنوان: |
Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process |
المؤلفون: |
Tang, Y., Zhou, B., Huang, J. H., Wu, Z. Z., Li, G. Y. |
المصدر: |
2014 15th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. :141-144 May, 2014 |
Relation: |
2014 15th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: |
IEEE Xplore Digital Library |