مؤتمر
Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process
| العنوان: | Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process |
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| المؤلفون: | Tang, Y., Zhou, B., Huang, J. H., Wu, Z. Z., Li, G. Y. |
| المصدر: | 2014 15th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. :141-144 May, 2014 |
| Relation: | 2014 15th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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