مؤتمر
USJ engineering impacts on FinFETs and RDF investigation using full 3D process/device simulation
| العنوان: | USJ engineering impacts on FinFETs and RDF investigation using full 3D process/device simulation |
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| المؤلفون: | Bazizi, E. M, Zaka, A., Herrmann, T., Benistant, F., Tin, J. H. M., Goh, J. P., Jiang, L., Joshi, M., van Meer, H., Korablev, K. |
| المصدر: | 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on. :25-28 Sep, 2014 |
| Relation: | 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479952878 9781479952854 9781479952885 9781479952861 |
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| تدمد: | 19461569 19461577 |
| DOI: | 10.1109/SISPAD.2014.6931554 |