مؤتمر
Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond
| العنوان: | Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond |
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| المؤلفون: | Lin, Y. M., Hsu, S. K., Hsu, L. C., Hsu, C. H., Wu, C. L., Lee, W. K., Lin, W. C., Sie, W. S., Liu, Y. L., Lee, Y. T., Wang, Oliver, Huang, C. C., Lin, J. F., Wu, J. Y. |
| المصدر: | Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :221-224 Nov, 2014 |
| Relation: | 2014 International Conference on Planarization/CMP Technology (ICPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479955565 9781479955572 |
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| DOI: | 10.1109/ICPT.2014.7017284 |