Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

التفاصيل البيبلوغرافية
العنوان:	Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
المؤلفون:	Wojnowski, M., Pressel, K., Beer, G., Heinig, A., Dittrich, M., Wolf, J.
المصدر:	2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th. :122-127 Dec, 2014
Relation:	2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
ردمك:	9781479969944
DOI:	10.1109/EPTC.2014.7028413