مؤتمر
Reliability study of the laminate-based flip-chip chip scale package
| العنوان: | Reliability study of the laminate-based flip-chip chip scale package |
|---|---|
| المؤلفون: | Matsuda, Y., Takai, T., Okada, Y., Lall, P., Koehler, C., Tessier, T., Olsen, D. |
| المصدر: | 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Electronic manufacturing technology and microelectronics IEMT/IMC Symposium, 2nd 1998. :40-44 1998 |
| Relation: | 2nd 1998 IEMT/IMC Symposium |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780350901 9780780350908 |
|---|---|
| DOI: | 10.1109/IEMTIM.1998.704506 |