High density printed circuit board using B/sup 2/it/sup TM/ technology

التفاصيل البيبلوغرافية
العنوان: High density printed circuit board using B/sup 2/it/sup TM/ technology
المؤلفون: Goto, K., Oguma, T., Fukuoka, Y.
المصدر: 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Electronic manufacturing technology and microelectronics IEMT/IMC Symposium, 2nd 1998. :316-320 1998
Relation: 2nd 1998 IEMT/IMC Symposium
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780350901
9780780350908
DOI:10.1109/IEMTIM.1998.704667