مؤتمر
High density printed circuit board using B/sup 2/it/sup TM/ technology
العنوان: | High density printed circuit board using B/sup 2/it/sup TM/ technology |
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المؤلفون: | Goto, K., Oguma, T., Fukuoka, Y. |
المصدر: | 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Electronic manufacturing technology and microelectronics IEMT/IMC Symposium, 2nd 1998. :316-320 1998 |
Relation: | 2nd 1998 IEMT/IMC Symposium |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780350901 9780780350908 |
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DOI: | 10.1109/IEMTIM.1998.704667 |