مؤتمر
Study of Cu contamination during copper integration in a dual damascene architecture for sub-quarter micron technology
| العنوان: | Study of Cu contamination during copper integration in a dual damascene architecture for sub-quarter micron technology |
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| المؤلفون: | Torres, J., Palleau, J., Motte, P., Tardif, F., Bernard, H. |
| المصدر: | Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) Interconnect technology Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International. :232-234 1998 |
| Relation: | Proceedings of the IEEE 1998 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780342852 9780780342859 |
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| DOI: | 10.1109/IITC.1998.704908 |