مؤتمر
Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
| العنوان: | Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study |
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| المؤلفون: | Wang, D. D., Wang, W. L., Huang, Y. M., Lek, A., Lam, J., Mai, Z. H. |
| المصدر: | 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International. :107-110 Oct, 2014 |
| Relation: | 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479973088 9781479972869 9781479972746 |
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| تدمد: | 19308841 23748036 |
| DOI: | 10.1109/IIRW.2014.7049522 |