التفاصيل البيبلوغرافية
| العنوان: |
A novel 3D thermal impedance model for high power modules considering multi-layer thermal coupling and different heating/cooling conditions |
| المؤلفون: |
Bahman, Amir Sajjad, Ma, Ke, Blaabjerg, Frede |
| المصدر: |
2015 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2015 IEEE. :1209-1215 Mar, 2015 |
| Relation: |
2015 IEEE Applied Power Electronics Conference and Exposition (APEC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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