مؤتمر
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
العنوان: | Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces |
---|---|
المؤلفون: | Chih-Han Tseng, Liu, Chien-Min, Lin, Han-wen, Yi-Cheng Chu, Chen, Chih, Dian-Rong Lyu, Chen, Kuan-Neng, Tu, K. N. |
المصدر: | 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :523-526 Apr, 2015 |
Relation: | 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9784904090121 9784904090138 |
---|---|
DOI: | 10.1109/ICEP-IAAC.2015.7111070 |