مؤتمر
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
| العنوان: | Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces |
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| المؤلفون: | Chih-Han Tseng, Liu, Chien-Min, Lin, Han-wen, Yi-Cheng Chu, Chen, Chih, Dian-Rong Lyu, Chen, Kuan-Neng, Tu, K. N. |
| المصدر: | 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :523-526 Apr, 2015 |
| Relation: | 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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