دورية أكاديمية
Using Wafer Map Features to Better Predict Die-Level Failures in Final Test
| العنوان: | Using Wafer Map Features to Better Predict Die-Level Failures in Final Test |
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| المؤلفون: | Kang, S., Cho, S., An, D., Rim, J. |
| المصدر: | IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 28(3):431-437 Aug, 2015 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 08946507 15582345 |
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| DOI: | 10.1109/TSM.2015.2443864 |