مؤتمر
Optimization of HV LDMOS devices accounting for packaging interaction
| العنوان: | Optimization of HV LDMOS devices accounting for packaging interaction |
|---|---|
| المؤلفون: | Arienti, G., Imperiale, I., Reggiani, S., Gnani, E., Gnudi, A., Baccarani, G., Nguyen, L., Hernandez-Luna, A., Huckabee, J., Denison, M. |
| المصدر: | 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on. :305-308 May, 2015 |
| Relation: | 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479962594 9781479962617 |
|---|---|
| تدمد: | 10636854 19460201 |
| DOI: | 10.1109/ISPSD.2015.7123450 |