The study of compensative structure assisted convex and concave corner structures etching by inductively coupled plasma-reactive ion etch (ICP-RIE)

التفاصيل البيبلوغرافية
العنوان: The study of compensative structure assisted convex and concave corner structures etching by inductively coupled plasma-reactive ion etch (ICP-RIE)
المؤلفون: Yu-Hsin Lin, Yuan-Chieh Cheng, Nien-Nan Chu, Wensyang Hsu, Yu-Hsiang Tang, Po-Li Chen, Chih-Chung Yang, Ming-Hua Hsiao, Chien-Nan Hsiao
المصدر: 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on. :491-493 Apr, 2015
Relation: 2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781467366953
DOI:10.1109/NEMS.2015.7147475