مؤتمر
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs
| العنوان: | Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs |
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| المؤلفون: | Kim, Jonghoon J., Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Jung, Daniel H., Kim, Joungho |
| المصدر: | 2014 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2014 International. :1-6 Dec, 2014 |
| Relation: | 2014 International 3D Systems Integration Conference (3DIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479984725 |
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| DOI: | 10.1109/3DIC.2014.7152151 |