مؤتمر
WLCSP+ and eWLCSP in FlexLine: Innovative Wafer Level Package manufacturing
| العنوان: | WLCSP+ and eWLCSP in FlexLine: Innovative Wafer Level Package manufacturing |
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| المؤلفون: | Lin, Yaojian, Chong, Eric, Chan, Mark, Lim, Kok Hwa, Yoon, Seung Wook |
| المصدر: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :865-870 May, 2015 |
| Relation: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479986095 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2015.7159694 |