مؤتمر
Silicon-packaged GaN power HEMTs with integrated heat spreaders
| العنوان: | Silicon-packaged GaN power HEMTs with integrated heat spreaders |
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| المؤلفون: | Herrault, F., Yajima, M., Margomenos, A., Corrion, A., Shinohara, K., Micovic, M. |
| المصدر: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1109-1114 May, 2015 |
| Relation: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479986095 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2015.7159733 |