مؤتمر
Preparation of reversible thermosets and their application in temporary adhesive for thin wafer handling
| العنوان: | Preparation of reversible thermosets and their application in temporary adhesive for thin wafer handling |
|---|---|
| المؤلفون: | Deng, L., Fang, H., Shuai, X., Zhang, G., Wong, C. P., Sun, R. |
| المصدر: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1197-1201 May, 2015 |
| Relation: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479986095 |
|---|---|
| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2015.7159747 |