مؤتمر
A new localized ink coating methodology for preventing photoresist deformation for TEM sample preparation
| العنوان: | A new localized ink coating methodology for preventing photoresist deformation for TEM sample preparation |
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| المؤلفون: | Seah, S. S., Tee, I., Liu, B. H., Er, E., Zhao, S. P., Lam, J. |
| المصدر: | 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the. :263-266 Jun, 2015 |
| Relation: | 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479999286 |
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| تدمد: | 19461542 19461550 |
| DOI: | 10.1109/IPFA.2015.7224393 |