Micro heatpipe integrated with LED silicon substrate

التفاصيل البيبلوغرافية
العنوان: Micro heatpipe integrated with LED silicon substrate
المؤلفون: Luo, Yi, Yu, Beike, Zhou, Chuanpeng, Wang, Xiaodong
المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :85-88 Aug, 2015
Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781467379991
9781467379984
DOI:10.1109/ICEPT.2015.7236550