مؤتمر
Study on the impact of height of solder joints with compliant layer on stress and strain under thermal cycle
| العنوان: | Study on the impact of height of solder joints with compliant layer on stress and strain under thermal cycle |
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| المؤلفون: | Xingjin, Zhou, Chunyue, Huang, Tianming, Li, Ying, Liang, Liangbin, Shao |
| المصدر: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :705-710 Aug, 2015 |
| Relation: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467379991 9781467379984 |
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| DOI: | 10.1109/ICEPT.2015.7236682 |