مؤتمر
Experimental modal analysis of PBGA printed circuit board assemblies
| العنوان: | Experimental modal analysis of PBGA printed circuit board assemblies |
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| المؤلفون: | Yang, Q.J., Lim, G.H., Lin, R.M., Yap, F.F., Pang, H.L.J., Wang, Z.P. |
| المصدر: | Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) Electronic packaging technology Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st. :290-296 1997 |
| Relation: | Proceedings of the 1997 1st Electronic Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780341570 9780780341579 |
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| DOI: | 10.1109/EPTC.1997.723924 |