مؤتمر
Fatigue reliability model of solder interconnects for first and second-level packaging
العنوان: | Fatigue reliability model of solder interconnects for first and second-level packaging |
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المؤلفون: | Di Giacomo, G., Li, L. |
المصدر: | Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) Electronic manufacturing technology Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT. :415-422 1998 |
Relation: | Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium. Proceedings 1998 IEMT Symposium |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780345231 9780780345232 |
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تدمد: | 10898190 |
DOI: | 10.1109/IEMT.1998.731167 |