مؤتمر
Fatigue reliability model of solder interconnects for first and second-level packaging
| العنوان: | Fatigue reliability model of solder interconnects for first and second-level packaging |
|---|---|
| المؤلفون: | Di Giacomo, G., Li, L. |
| المصدر: | Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) Electronic manufacturing technology Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT. :415-422 1998 |
| Relation: | Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium. Proceedings 1998 IEMT Symposium |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780345231 9780780345232 |
|---|---|
| تدمد: | 10898190 |
| DOI: | 10.1109/IEMT.1998.731167 |