Full 3D reciprocal space map of thin polycrystalline films for microelectronic applications

التفاصيل البيبلوغرافية
العنوان: Full 3D reciprocal space map of thin polycrystalline films for microelectronic applications
المؤلفون: Thanh, T. Nguyen, Blanc, N., Boudet, N., Bourjot, E., Zhiou, S., Kovacova, V., Rodriguez, P., Nemouchi, F., Gergaud, P.
المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :53-56 May, 2015
Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781467373562
9781467373555
تدمد:2380632X
23806338
DOI:10.1109/IITC-MAM.2015.7325624