مؤتمر
Copper micro and nano particles mixture for 3D interconnections application
| العنوان: | Copper micro and nano particles mixture for 3D interconnections application |
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| المؤلفون: | Yuan Yuan Dai, Mei Zhen Ng, Anantha, P, Chee Lip Gan, Chuan Seng Tan |
| المصدر: | 2015 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2015 International. :TS8.9.1-TS8.9.5 Aug, 2015 |
| Relation: | 2015 International 3D Systems Integration Conference (3DIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467393850 9781467393843 |
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| DOI: | 10.1109/3DIC.2015.7334614 |