مؤتمر
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
| العنوان: | Investigating mechanical performance of PLA and CA biodegradable printed circuit boards |
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| المؤلفون: | Geczy, Attila, Nagy, Daniel, Hajdu, Istvan, Kmetty, Akos, Szolnoki, Beata |
| المصدر: | 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for. :45-49 Oct, 2015 |
| Relation: | 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509003327 9781509003310 |
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| DOI: | 10.1109/SIITME.2015.7342293 |